Hardware

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Motherboard

Nintendo Switch 2

Product Code Description
BEE-CPU-01 Retail Nintendo Switch 2

DRAM Layout

The footprint is BGA-441 (JEDEC MO-342), with ballout defined by JEDEC JESD209-5C (LPDDR5X). This annotated image shows the signals routed on the top layer of the PCB, for the IC south of the SoC. The signals routed here are CS0-1, CA0-6, and CK, for each of the four channels.

Error creating thumbnail: UnableToLoadModule `/usr/lib/x86_64-linux-gnu/ImageMagick-6.9.12/modules-Q16/coders/jpeg.la': file not found @ error/module.c/OpenModule/1318

Specifications

Nintendo Switch 2

Component Description
SoC NVIDIA GMLX30-A1 (T239)
Screen Innolux ZD079KA-03A
Storage Toshiba/Kioxia THGJFGT1E45BAILHW0 256 GB UFS 3.1
or
SKhynix HN8T15DEHKX075 256 GB UFS 3.1
Memory SKhynix H58GE6AK8BX107 6 GB LPDDR5X DRAM x2 (12GB total)

or Samsung K3KL2L20DM-JGCT 6 GB LPDDR5X DRAM x2 (12GB total)

Wifi/BT MediaTek MT3681AEN (same footprint and similar pinout to MT7921LEN)
PMIC Maxim Integrated MAX77851SAWJ+T
Sub-PMIC Renesas/Dialog DA9092-AIOV2
Audio Realtek ALC5658
Voice Intelligo Technology IG2200
USB 2.0 Hub Genesys Logic GL852G-OHY60 (Connects to joycons, WiFi/BT IC, with upstream port to SoC)
USB-C Cypress CYPD6228-96BZXI (CP10359AT)
GC ASIC B2349 GCBRG HAC STD T2010423